Samsung to Begin Production of 2nm Chips in 2025 and 1.4nm Chips by 2027 Amidst Competition with TSMC
Overview of Samsung’s Chip Production Roadmap
In a push to expand its semiconductor manufacturing business, South Korean tech giant, Samsung has recently outlined its plan to launch the production of 2nm chips as early as 2025. The roadmap includes details of extending its production to high-performance computing in 2026 and automotive applications in 2027.
The company also revealed plans for a tighter transistor pitch, preparing to work on a 1.4nm process by 2027. This ambitious roadmap reflects Samsung’s determination in becoming the world leader in advanced mobile chip technology.
Understanding the 2nm Process
The nanometer (nm) process refers to the size of each individual transistor on a semiconductor chip. As such, the smaller the value, the more transistors can fit onto a single chip, leading to more powerful and efficient output. Todayâs top-of-the-line Qualcommâs Snapdragon uses a relatively larger 4nm process.
For comparison, Samsungâs plan for producing 2nm process for mobile applications will mean potentially more advanced chips that could change future technological scenarios.
Promising Performance Increases and Efficiency
Samsung’s new semiconductors vow substantial efficiency gains along with promising performance increments. The company’s reported data reveals that when compared with the currently produced 3nm semiconductors, its future 2nm chips will show a significant increase in performance â roughly around 12%. They will also be about 25% more power-efficient and require less area, by about 5%.
Higher performance computing mentioned in the roadmap points at developing chips designed specifically for AI-powered data center operations. With the ubiquity of AI reaching new heights quickly, Samsung is seeking opportunities to leverage this growth within their semiconductor manufacturing sector.
Competitive Landscape: Samsung vs TSMC
Thrusting itself into fierce competition with Taiwan Semiconductor Manufacturing Company (TSMC)âthe leading contract manufacturer of semiconductorsâSamsung hopes this pivot towards smaller nm processes will bolster their rankings within the global semiconductor landscape.
In Q1 of this year, TSMC singlehandedly held around a staggering 59% share in global semiconductor foundry revenue, as per Counterpoint Research’s data â dwarfing Samsung’s contribution which was only around roughly13%.
Moreover, both companies are reportedly on track aiming to deliver similarly advanced technology; TSMC too is striving for establishing their own robust infrastructure for launching their own line of chips using the same process â fabricating microscopic yet powerful and efficient 2nm chips by 2025.
Global Expansion Plans: South Korea and Texas
In an apparent bid to upsurge its overall chip manufacturing capacity as well as accelerate the implementation of these state-of-the-art technological innovations, Samsung plans on constructing additional facilities not just locally in Pyeongtaek, South Korea but also internationallyânamely Taylor, Texasâin order to satiate global demands more efficiently.
The Korean juggernaut estimates that mass production at its Pyeongtaek Line number three plant would commence somewhere during H2 of ’23. On the other hand preparations are underway and due end by this year which would transition facilities’ operational capacities online during H2 ’24 at Taylor Texas Fab plant.
Futuristic Endeavours Beyond Silicon
Going beyond hyped statistic upgrades or vanquishing conventional silicon-based trajectories;Samsung is also eyeing materials science since room for enhancing performances via traditional methods appears imminently saturated. Surprisingly around same timeâduring 2025âin order to target consumer products,datacentre applications as well as commercial vehiclesâSamsung would be launching foundry services dealing in GaN (Gallium Nitride) based eight-inch power semiconductors.
Apart from getting protocols ready for AI-requirements,Samsung also revealed plans working towards accommodating connectivity standards that’d be space-age compared today.Unveiling its development track for making five-nanometer sized Radio Frequency (RF) chip available during first half ’25.This radio wave emitting chip targets eventual six-generation (6G) applications claiming forty percent improvement in overall power efficiency even halving footprint area compared existing four-teen nanometre process.