Preliminary specs of the Snapdragon 820 reveal thermal improvements compared to S810

Snapdragon 820

Those familiar with smartphones of this year will have certainly known about the kind of impact that the Snapdragon 810 has had on the Android world. The likes of the HTC One M9, the LG G Flex2 etc were the first to use Qualcomm’s ill fated chipset, while more recent devices like the Xperia Z4 as well as the OnePlus 2 are also running the said chipset.

And in order to combat this, Qualcomm announced the development of a new mobile SoC, dubbed the Snapdragon 820. A recent rumor however suggested that even this chipset had overheating issues of its own, creating further worry for the manufacturers. However, a new specs sheet of the Snapdragon 820 indicates that the overheating issues have been resolved to a great extent compared to the Snapdragon 810.

It is said that the thermal issues have been brought down largely due to the new 14nm manufacturing process used by Qualcomm. While this is welcoming news for Qualcomm and the manufacturers, nothing can be ascertained until we get to see real world performance of the Snapdragon 820. It is being rumored that the Snapdragon 820 will be used on the upcoming Huawei Nexus smartphone.

Source: Weibo

Via: Mobile Syrup

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