The #Samsung #GalaxyS7 is expected to be released in February 2016 as we all know by now. We’ve heard reports about the company testing prototypes with the record-breaking Exynos 8890 chipset as well as Qualcomm’s upcoming #Snapdragon820 silicon. A new report now suggests that the company is contemplating the use of a heat pipe in order to quell any fears of overheating.
A heat pipe is typically used by PC manufacturers to keep the CPU heating to minimum levels. Mobile manufacturers like OnePlus, Xiaomi and Sony have resorted to using heat pipes in their most recent flagships. Not coincidentally, all these devices feature Qualcomm’s Snapdragon 810 chip, which has been prone to heating more than usual.
This report stems from China and there’s no word on whether Samsung is taking this as a precautionary measure or if the company has actually encountered overheating complaints with the Exynos 8890 or the Snapdragon 820 chip. It’s too early to jump to conclusions, so we’ll deem this a speculation for now. Samsung will surely not want to compromise on the quality of its flagship, especially since the stakes are so high right now.
Source: UDN – Translated
Via: Phone Arena